Wavelength-converting component, projection apparatus and manufacturing method of the wavelength-converting component

ABSTRACT

A wavelength-converting component includes a substrate, a wavelength-converting layer and a reflective layer. The wavelength-converting layer is disposed on the substrate. The reflective layer is disposed between the substrate and the wavelength-converting layer. The reflective layer includes a plurality of diffuse reflection particles and a first organic adhesive. The diffuse reflection particles are mixed in the first organic adhesive. The first organic adhesive includes an aromatic polyimide. The invention further provides a projection apparatus using the wavelength-converting component and provides a manufacturing method of the wavelength-converting component. The wavelength-converting component of the invention can improve mechanical properties such as shear strength, tensile strength and fatigue strength, temperature resistance and reflectivity, and can reduce rates of moisture absorption. The projection apparatus of the invention can reduce degradation in image brightness.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of China application201810743473.9, filed on Jul. 9, 2018. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

FIELD OF THE INVENTION

The invention relates to a display apparatus, and more particularly to awavelength-converting component, a projection apparatus using thewavelength-converting component and a manufacturing method of thewavelength-converting component.

BACKGROUND OF THE INVENTION

With the market requirements for projection apparatus in brightness,color saturation, service life, non-toxic environmental protection,etc., the types of light sources used in the projection apparatus haveevolved from a UHP lamp, a light emitting diode (LED) to a laser diode(LD).

At present, the cost of high-brightness red laser diodes and green laserdiodes is too high. In order to reduce the cost, a blue laser diode isused to excite the phosphor powder on the phosphor wheel to generateyellow light and green light, and then the desired red light is filteredout by a filter wheel. Together with the blue light emitted by the bluelaser diode, the three primary colors of red, green and blue requiredfor the projection image are generated.

The phosphor wheel is an extremely important component of the projectionapparatus using a laser diode as a light source currently. However, theconventional phosphor wheel uses a highly transparent silica gel mixedwith phosphor powder or reflective material. Due to the poor thermalconductivity and low temperature resistance of the highly transparentsilica gel, it cannot satisfy the demand of high-power laser projectionapparatus. If a glass-based material mixed with phosphor powder or areflective material is used instead, although the above-mentioneddisadvantages can be reduced, the glass-based material is required toperform heat curing at a high temperature greater than 400° C., and theglass-based material after curing has more pores, which may affect thethermal conductivity of the material, and the pores may absorb liquids,which may also affect the material selection of subsequent manufacturingprocess of the phosphor wheel.

The information disclosed in this “BACKGROUND OF THE INVENTION” sectionis only for enhancement understanding of the background of the inventionand therefore it may contain information that does not form the priorart that is already known to a person of ordinary skill in the art.Furthermore, the information disclosed in this “BACKGROUND OF THEINVENTION” section does not mean that one or more problems to be solvedby one or more embodiments of the invention were acknowledged by aperson of ordinary skill in the art.

SUMMARY OF THE INVENTION

The invention provides a wavelength-converting component, which canimprove mechanical properties such as shear strength, tensile strengthand fatigue strength, temperature resistance and reflectivity, and canreduce rates of moisture absorption.

The invention provides a manufacturing method of a wavelength-convertingcomponent, which can improve mechanical properties such as shearstrength, tensile strength and fatigue strength, temperature resistanceand reflectivity, and can reduce rates of moisture absorption of thewavelength-converting component.

The invention provides a projection apparatus, which can reducedegradation in image brightness.

Other advantages and objects of the invention may be further illustratedby the technical features broadly embodied and described as follows.

In order to achieve one or a portion of or all of the objects or otherobjects, a wavelength-converting component provided by an embodiment ofthe invention includes a substrate, a wavelength-converting layer and areflective layer. The wavelength-converting layer is disposed on thesubstrate. The reflective layer is disposed between the substrate andthe wavelength-converting layer. The reflective layer includes aplurality of diffuse reflection particles and a first organic adhesive.The diffuse reflection particles are mixed in the first organicadhesive. The first organic adhesive includes an aromatic polyimide.

In order to achieve one or a portion of or all of the objects or otherobjects, a projection apparatus provided by an embodiment of theinvention includes an illumination system, a light valve and aprojection lens. The illumination system is configured to provide anillumination beam. The light valve is disposed on a transmission path ofthe illumination beam to convert the illumination beam into an imagebeam. The projection lens is disposed on a transmission path of theimage beam. The illumination system includes an excitation light sourceand the wavelength-converting component. The excitation light source isconfigured to provide an excitation beam. The wavelength-convertingcomponent is disposed on a transmission path of the excitation beam. Thewavelength-converting layer of the wavelength-converting component isconfigured to convert the excitation beam into a converted beam, and theillumination beam includes the converted beam.

In order to achieve one or a portion of or all of the objects or otherobjects, a manufacturing method of a wavelength-converting componentprovided by an embodiment of the invention includes: providing asubstrate, wherein the substrate has a first surface and a secondsurface opposite to the first surface; providing a wavelength-convertinglayer, wherein the wavelength-converting layer has a third surface and afourth surface opposite to the third surface, and the third surface ofthe wavelength-converting layer faces the second surface of thesubstrate; and providing a reflective layer, wherein the reflectivelayer has a fifth surface and a sixth surface opposite to the fifthsurface, and the reflective layer is located between the second surfaceof the substrate and the third surface of the wavelength-convertinglayer. The fifth surface faces the second surface of the substrate, andthe sixth surface faces the third surface of the wavelength-convertinglayer. The reflective layer includes a plurality of diffuse reflectionparticles and a first organic adhesive, and the diffuse reflectionparticles are mixed in the first organic adhesive. The first organicadhesive includes an aromatic polyimide, and the method for providingthe reflective layer includes forming the reflective layer on a formingsurface by performing heat curing.

In order to achieve one or a portion of or all of the objects or otherobjects, a manufacturing method of a wavelength-converting componentprovided by an embodiment of the invention includes: providing asubstrate; providing a reflective layer disposed on the substrate; andproviding a wavelength-converting layer disposed on a surface of thereflective layer away from the substrate. The wavelength-convertinglayer includes a wavelength-converting material and a second organicadhesive, and the wavelength-converting material is mixed in the secondorganic adhesive. The second organic adhesive includes an aromaticpolyimide. A method for providing the wavelength-converting layerincludes forming the wavelength-converting layer on a surface of thereflective layer away from the substrate by performing heat curing.

In the wavelength-converting component of the embodiments of theinvention, the reflective layer includes a first organic adhesive anddiffuse reflection particles. The first organic adhesive includes anaromatic polyimide. Since curing temperatures of the first organicadhesive using the above formula are only from 200° C. to 300° C.,compared to the curing temperature of conventional glass-based materialrequired to be greater than 400° C., the reflective layer of theembodiments of the invention can reduce the fine pores generated bysintering at a high temperature (>400° C.) and the characteristics ofeasily adsorbing liquids. The curing process where the temperature isincreased in stages, can improve mechanical properties such as shearstrength, tensile strength and fatigue strength of the entire structureof the reflective layer. In addition, chemical stability of the benzenering structure contained in the aromatic polyimide is higher, which alsocontributes to the improvement of the mechanical properties such asshear strength, tensile strength and fatigue strength of the entirestructure of the reflective layer, and can improve the temperatureresistance. The aromatic structure has hydrophobic properties, which canalso reduce rates of moisture absorption. The manufacturing method ofthe wavelength-converting component of the embodiments of the inventionuses the above-mentioned first organic adhesive. Therefore, theabove-mentioned wavelength-converting component can be produced. Theprojection apparatus of the embodiment of the invention can reducedegradation in image brightness by using the above-mentionedwavelength-converting component.

Other objectives, features and advantages of The invention will befurther understood from the further technological features disclosed bythe embodiments of The invention wherein there are shown and describedpreferred embodiments of this invention, simply by way of illustrationof modes best suited to carry out the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1A is a schematic view of a wavelength-converting componentaccording to an embodiment of the invention;

FIG. 1B is a schematic view of a wavelength-converting componentaccording to another embodiment of the invention;

FIG. 2 is a schematic view of a light spot formed by a light on awavelength-converting component according to an embodiment of theinvention;

FIG. 3 is a schematic view showing the results of thermogravimetricanalysis of an aromatic polyimide according to an embodiment of theinvention;

FIG. 4 is a schematic view showing the results of the lighttransmittance of the aromatic polyimide according to an embodiment ofthe invention;

FIG. 5 is a schematic flow chart showing a manufacturing method of awavelength-converting component according to an embodiment of theinvention;

FIG. 6 is a schematic view of a wavelength-converting componentaccording to another embodiment of the invention;

FIG. 7 is a schematic flow chart showing a manufacturing method of awavelength-converting component according to another embodiment of theinvention;

FIG. 8A is a schematic view of a wavelength-converting componentaccording to another embodiment of the invention;

FIG. 8B is a schematic view of a wavelength-converting componentaccording to another embodiment of the invention; and

FIG. 9 is a schematic block diagram of a projection apparatus accordingto an embodiment of the invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In the following detailed description of the preferred embodiments,reference is made to the accompanying drawings which form a part hereof,and in which is shown by way of illustration specific embodiments inwhich the invention may be practiced. In this regard, directionalterminology, such as “top”, “bottom”, “front”, “back”, etc., is usedwith reference to the orientation of the Figure(s) being described. Thecomponents of the invention can be positioned in a number of differentorientations. As such, the directional terminology is used for purposesof illustration and is in no way limiting. On the other hand, thedrawings are only schematic and the sizes of components may beexaggerated for clarity. It is to be understood that other embodimentsmay be utilized and structural changes may be made without departingfrom the scope of the invention. Also, it is to be understood that thephraseology and terminology used herein are for the purpose ofdescription and should not be regarded as limiting. The use of“including”, “comprising”, or “having” and variations thereof herein ismeant to encompass the items listed thereafter and equivalents thereofas well as additional items. Unless limited otherwise, the terms“connected”, “coupled”, and “mounted” and variations thereof herein areused broadly and encompass direct and indirect connections, couplings,and mountings. Similarly, the terms “facing”, “faces”, and variationsthereof herein are used broadly and encompass direct and indirectfacing, and “adjacent to” and variations thereof herein are used broadlyand encompass directly and indirectly “adjacent to”. Therefore, thedescription of “A” component facing “B” component herein may contain thesituations that “A” component facing “B” component directly or one ormore additional components is between “A” component and “B” component.Also, the description of “A” component “adjacent to” “B” componentherein may contain the situations that “A” component is directly“adjacent to” “B” component or one or more additional components isbetween “A” component and “B” component. Accordingly, the drawings anddescriptions will be regarded as illustrative in nature and not asrestrictive.

FIG. 1A is a schematic view of a wavelength-converting componentaccording to an embodiment of the invention. Please refer to FIG. 1A. Awavelength-converting component 100 of the embodiment includes asubstrate 110, a wavelength-converting layer 120 and a reflective layer130. The wavelength-converting component 100 is, for example, asheet-like component, but is not limited thereto. In other embodiments,the wavelength-converting component 100 may also be awavelength-converting wheel, and the substrate 110 is, for example, aturntable. The wavelength-converting layer 120 is disposed on thesubstrate 110. The reflective layer 130 is disposed between thesubstrate 110 and the wavelength-converting layer 120. The reflectivelayer 130 includes, for example, a plurality of diffuse reflectionparticles and a first organic adhesive. The diffuse reflection particlesare mixed in the first organic adhesive. The first organic adhesiveincludes an aromatic polyimide, and curing temperatures of the firstorganic adhesive are from 200° C. to 300° C.

A material of the substrate 110 is, for example, a metal, but is notlimited thereto, and the metal includes, for example, aluminum, analuminum alloy, copper, a copper alloy, aluminum nitride, siliconcarbide, etc.

A material of the diffuse reflection particles is, for example, whiteparticles, and includes at least one of titanium dioxide, silicondioxide, aluminum oxide, boron nitride and zirconium dioxide.

In an embodiment of FIG. 1A, the wavelength-converting layer 120includes, for example, a wavelength-converting material and an adhesive.The wavelength-converting material is mixed with the adhesive. Thewavelength-converting material is, for example, a phosphor or quantumdots. The adhesive may be a second organic adhesive or an inorganicadhesive. The ingredients of the second organic adhesive are, forexample, the same as the first organic adhesive. That is, the secondorganic adhesive includes an aromatic polyimide, and curing temperaturesof the second organic adhesive are from 200° C. to 300° C., and theinorganic adhesive includes, for example, at least one of a glass paste,a water glass and a silica gel.

FIG. 1B is a schematic view of a wavelength-converting componentaccording to another embodiment of the invention. Please refer to FIG.1B. The structure of the wavelength-converting component 1001 of theembodiment is similar to the structure of the wavelength-convertingcomponent 100 of the embodiment in FIG. 1A. The difference is that thewavelength-converting component 1001 further includes, for example, anintermediate layer 140 disposed between the substrate 110 and thereflective layer 130. The intermediate layer 140 is configured to bondthe substrate 110 and the reflective layer 130 in the manufacturingprocess of the wavelength-converting component 1001. A material of theintermediate layer 140 includes, for example, a silica gel, an epoxyresin or a thermally conductive adhesive. The thermally conductiveadhesive is further configured to assist the reflective layer 130 toconduct heat. When the thermally conductive adhesive is used as theintermediate layer 140, a thermal conductivity of the reflective layer130 is required to be less than or equal to a thermal conductivity ofthe intermediate layer 140, so that the heat generated by the highenergy of an incident light can be conducted by the thermally conductiveadhesive to achieve a heat dissipation effect. In addition, thethermally conductive adhesive can further be used as a sheet-likethermally conductive patch in addition to being coated in a liquid form.In an embodiment of FIG. 1B, the wavelength-converting layer 120includes, for example, a phosphor in glass, a phosphor in ceramic, apolycrystalline fluorescent sheet, a monocrystalline fluorescent sheetor a phosphor in silicon, but is not limited thereto. In anotherembodiment of FIG. 1B, the wavelength-converting layer 120 includes, forexample, a wavelength-converting material and an adhesive. Thewavelength-converting material is mixed in the adhesive. Thewavelength-converting material and the adhesive of the embodiment are,for example, the wavelength-converting material and the adhesive of theembodiment in FIG. 1A, but are not limited thereto.

FIG. 2 is a schematic view of a light spot formed by a light on awavelength-converting component according to an embodiment of theinvention. Please refer to FIG. 1A, 1B and FIG. 2. When thewavelength-converting layer 120 and the reflective layer 130 aredisposed on the substrate 110, the widths D of the wavelength-convertinglayer 120 and the reflective layer 130 in the direction A parallel tothe substrate 110 (the widths of the two layers are the same in theembodiment, therefore only D represents the widths of the two layers)are required to be greater than a long axis B of a light spot S formedby a light irradiated on the wavelength-converting components 100, 1001(FIG. 2 is illustrated by the wavelength-converting component 100 ofFIG. 1A and the uppermost wavelength-converting layer 120), so that alight can be irradiated on the wavelength-converting components 100,1001 to improve the utilization of light.

In the wavelength-converting components 100, 1001 of the embodiments ofFIG. 1A and FIG. 1B, the reflective layer 130 includes a first organicadhesive and diffuse reflection particles. The first organic adhesiveincludes an aromatic polyimide. Since curing temperatures of the firstorganic adhesive using the above formula are only from 200° C. to 300°C., compared to the curing temperature of the conventional glass-basedmaterial, which is greater than 400° C., the reflective layer 130 of theembodiment of the invention can reduce the fine pores generated bysintering at a high temperature (>400° C.) and the characteristics ofeasily adsorbing liquids. The curing process where the temperature isincreased in stages, can improve mechanical properties such as shearstrength, tensile strength and fatigue strength of the entire structureof the reflective layer 130. In addition, chemical stability of thebenzene ring structure contained in the aromatic polyimide is higher,which also helps to improve the mechanical properties such as shearstrength, tensile strength and fatigue strength of the entire structureof the reflective layer 130, and can improve temperature resistance. Asshown in thermogravimetric analysis results of FIG. 3, a pyrolysistemperature of the aromatic polyimide is higher than 500° C., and thearomatic structure has a hydrophobic property and can also reduce ratesof moisture absorption. According to the experimental analysis, a waterabsorption result of the aromatic polyimide is less than 0.5%, and thewater vapor transmission rate is less than 0.1 g/day/m2.

Since the reflective layer 130 of the embodiment can reduce the finepores generated by sintering at a high temperature, and the aromaticpolyimide has a transmittance greater than 90% for a light having awavelength in a visible light region (550 nm), as the result shown inFIG. 4, the light is more easily reflected by the diffuse reflectionparticles when it is incident on the reflective layer 130, so thatreflectivity of the wavelength-converting components 100, 1001 can alsobe improved. In the embodiment, the reflective layer 130 has areflectivity greater than or equal to 92% for a light having awavelength from 400 nm to 700 nm. In order to achieve a better diffusereflection effect, the thickness of the reflective layer 130 in thedirection C perpendicular to the substrate 110 is, for example, from0.03 mm to 0.15 mm. The particle diameters of the diffuse reflectionparticles are, for example, from 5 nm to 500 nm. In addition, the volumeratio of the first organic adhesive to the reflective layer 130 is, forexample, from 25% to 75%. When a ratio of the first organic adhesive istoo low, the diffuse reflection particles are easily detached. When aratio of the first organic adhesive is too high, the diffuse reflectioneffect may be affected.

FIG. 5 is a schematic flow chart showing a manufacturing method of awavelength-converting component according to an embodiment of theinvention. Please refer to FIG. 1A, FIG. 1B and FIG. 5. Themanufacturing method of the wavelength-converting components 100, 1001of the embodiment includes the following steps: the step S101 isperformed to provide a substrate 110, wherein the substrate 110 has afirst surface 111 and a second surface 112 opposite to the first surface111.

The step S102 is performed to provide a wavelength-converting layer 120,wherein the wavelength-converting layer 120 has a third surface 121 anda fourth surface 122 opposite to the third surface 121, and the thirdsurface 121 of the wavelength-converting layer 120 faces the secondsurface 112 of the substrate 110.

The step S103 is performed to provide a reflective layer 130, whereinthe reflective layer 130 has a fifth surface 131 and a sixth surface 132opposite to the fifth surface 131. The reflective layer 130 is locatedbetween the second surface 112 of the substrate 110 and the thirdsurface 121 of the wavelength-converting layer 120, wherein the fifthsurface 131 faces the second surface 112 of the substrate 110, and thesixth surface 132 faces the third surface 121 of thewavelength-converting layer 120. In particular, the method for providingthe reflective layer 130 includes, for example, performing heat curingat temperatures from 200° C. to 300° C. after the reflective layer 130is coated on the forming surface. The different methods for providingthe reflective layer 130 are exemplified below.

In the step S103, a specific method of an embodiment for providing thereflective layer 130 is, for example, to synthesize an aromaticpolyimide, and to mix a plurality of diffuse reflection particles, thearomatic polyimide and an organic solvent, to coat on a forming surface,and to perform heat curing. Ingredients of the organic solvent include,for example, N-Methyl-2-Pyrrolidone (NMP), dimethylformamide (DMF),dimethylacetamide (DMAc), tetrahydrofuran (THF) or toluene.

The reaction process of the synthetic aromatic polyimide is as follows:

A polycondensation of an anhydride monomer with an aromatic aminemonomer is performed in an aprotic polar solvent to produce an aromaticpolyamic acid. A quantity of anhydride structures in the anhydridemonomer is greater than or equal to 2, and a quantity of aminestructures in the aromatic amine monomer is greater than or equal to 2.The anhydride monomer is preferably a dianhydride, and the aromaticamine monomer is preferably an aromatic diamine. The anhydride monomerused in the embodiment is a dianhydride

(5,5′-bis(isobenzofuran-1,3-dione)), wherein R is selected from O, S,CH₂, CF₂ or C(CF₃)₂. The specific examples of the aromatic diamine are,for example,

wherein X is selected from CH₃, CF₃, CBr₃, F, Cl or Br. The aromaticpolyamic acid is heated to dehydrate and cyclize (Imidization) toproduce the aromatic polyimide.

A specific method of another embodiment for providing the reflectivelayer 130 may also be, for example, performing a polycondensation of ananhydride monomer with an aromatic amine monomer in an aprotic polarsolvent to produce an aromatic polyamic acid; and adding and mixing witha plurality of diffuse reflection particles, coating on a formingsurface and performing heat curing, so that the aromatic polyamic acidis dehydrated and cyclized to produce the aromatic polyimide.

In addition, corresponding to FIG. 1A and FIG. 1B, in the step S103 ofthe manufacturing method of the wavelength-converting components 100,1001, the forming surfaces coated by the reflective layer 130 aredifferent, and further details will be explained below. Taking thewavelength-converting component 100 of FIG. 1A for example, the formingsurface coated by the reflective layer 130 is, for example, the secondsurface 112 of the substrate 110, but is not limited thereto. Taking thewavelength-converting component 1001 of FIG. 1B for example, when thewavelength-converting layer 120 is a solid structure such as a phosphorin glass, a phosphor in ceramic, a polycrystalline fluorescent sheet, amonocrystalline fluorescent sheet or a phosphor in silicon, the formingsurface may be the third surface 121 of the wavelength-converting layer120, wherein the manufacturing method of the wavelength-convertingcomponent 1001 further includes bonding the fifth surface 131 of thereflective layer 130 to the second surface 112 of the substrate 110 bythe intermediate layer 140.

In another embodiment exemplified by the wavelength-converting component1001 of FIG. 1B, the manufacturing method of the wavelength-convertingcomponent 1001 further includes providing a pre-formed substrate (notshown in the figure). The pre-formed substrate has a seventh surface.The forming surface of the reflective layer 130 is the seventh surfaceof the pre-formed substrate, and the fifth surface 131 of the reflectivelayer 130 is joined to the seventh surface of the pre-formed substrate.Next, separating the fifth surface 131 of the reflective layer 130 fromthe seventh surface of the pre-formed substrate, and bonding the fifthsurface 131 of the reflective layer 130 to the second surface 112 of thesubstrate 110 by the intermediate layer 140.

In the embodiment using the pre-formed substrate, a material of thepre-formed substrate is, for example, Teflon or metal coated with boronnitride dissolved in alcohol. By the non-stick property of thepre-formed substrate, the reflective layer 130 can be completelyseparated from the seventh surface of the pre-formed substrate afterbeing formed.

In addition to the reflective layer, the wavelength-converting layer mayalso be made by using an organic adhesive. FIG. 6 is a schematic view ofa wavelength-converting component according to another embodiment of theinvention. FIG. 7 is a schematic flow chart showing a manufacturingmethod of a wavelength-converting component according to anotherembodiment of the invention. Please refer to FIG. 6 and FIG. 7. Thewavelength-converting component 100 a of the embodiment is similar tothe wavelength-converting component 100 in structures and advantages.The manufacturing method of the wavelength-converting component 100 a ofthe embodiment includes the following steps: performing the step S201 toprovide a substrate 110.

The step S202 is performed to provide a reflective layer 130 a disposedon the substrate 110. In an embodiment, a material of the reflectivelayer 130 a includes, for example, silver, a silver alloy, aluminum, analuminum alloy or a dielectric. If a material of the reflective layer130 a is the metal as exemplified above, at least one of a dielectriclayer and a protective layer may be additionally added, and theprotective layer can protect the metal from being oxidized. In anotherembodiment, the reflective layer 130 a may also include, for example, aplurality of diffuse reflection particles and an adhesive, and thediffuse reflection particles are mixed in the adhesive. The type of theadhesive is not particularly limited. When the adhesive is the firstorganic adhesive, the reflective layer 130 a is the reflective layer130.

The step S203 is performed to provide a wavelength-converting layer 120a disposed on a surface 131 a of the reflective layer 130 a away fromthe substrate 110. The wavelength-converting layer 120 a includes awavelength-converting material and a second organic adhesive. Thewavelength-converting material is mixed in the second organic adhesive.The wavelength-converting material is, for example, a phosphor orquantum dots. The second organic adhesive is, for example, the firstorganic adhesive, but is not limited thereto. Specifically, when thewavelength-converting layer 120 a uses the first organic adhesive, aspecific method of an embodiment for providing the wavelength-convertinglayer 120 a includes, for example, synthesizing an aromatic polyimide.The wavelength-converting material, the aromatic polyimide and anorganic solvent are mixed and coated on the surface 131 a of thereflective layer 130 a away from the substrate 110, and heat curing isperformed at temperatures from 200° C. to 300° C. Ingredients of theorganic solvent include, for example, N-Methyl-2-Pyrrolidone (NMP),dimethylformamide (DMF), dimethylacetamide (DMAc), tetrahydrofuran (THF)or toluene. The reaction process for synthesizing the aromatic polyimideis as above, and no redundant detail is to be given herein. In addition,when the wavelength-converting layer 120 a uses the first organicadhesive, a specific method of another embodiment for providing thewavelength-converting layer 120 a may also be, for example, performing apolycondensation of an anhydride monomer with an aromatic amine monomerin an aprotic polar solvent to produce an aromatic polyamic acid, andthe wavelength-converting material is added thereto, mixed and coated onthe surface 131 a of the reflective layer 130 a away from the substrate110 and heat curing is performed to dehydrate and cyclize the aromaticpolyamic acid to produce the aromatic polyimide.

In order to achieve a better conversion effect of a light, the thicknessof the wavelength-converting layer 120 a is, for example, from 0.10 mmto 0.25 mm, and the percentage by weight of the first organic adhesiveto the wavelength-converting layer 120 a is, for example, from 10% to60%.

When manufacturing the wavelength-converting components 100, 1001 and100 a, the widths D of the reflective layers 130, 130 a and thewavelength-converting layers 120, 120 a in the direction A parallel tothe substrate 110 may be the same or different. However, in order toachieve a better diffuse reflection effect and a conversion effect, arange of the width ratio of the two is, for example, from 0.7 to 1.5. Inaddition, in an embodiment including the intermediate layer 140, a widthD of the intermediate layer 140 in the direction A parallel to thesubstrate 110 is required to be greater than, for example, a width D ofthe reflective layer 130, so that the entire structure of thewavelength-converting component 100 is more stable after the diffusereflective layer 130 is bonded to the substrate 110, or, the width D ofthe intermediate layer 140 in the direction A parallel to the substrate110 is required to be greater than, for example, the long axis B of thelight spot S (as shown in FIG. 2) to achieve the heat dissipationeffect. The coating conditions in different embodiments will beexemplified below.

In the embodiments of FIG. 1A, FIG. 1B and FIG. 6, the reflective layers130, 130 a and the wavelength-converting layers 120, 120 a have the samewidth D (hereinafter referred to as width) in the direction A parallelto the substrate 110. FIG. 8A is a schematic view of awavelength-converting component according to another embodiment of theinvention. FIG. 8B is a schematic view of a wavelength-convertingcomponent according to another embodiment of the invention. Please referto FIG. 8A and FIG. 8B. In the embodiment where a width D1 of thereflective layer 130 b is smaller than a width D2 of thewavelength-converting layer 120 b (FIG. 8A), when providing thewavelength-converting layer 120 b, the periphery of thewavelength-converting layer 120 b can cover, for example, two sides ofthe reflective layer 130 b and can be directly coated on the substrate110, so that the wavelength-converting layer 120 b can be more firmlyadhered to the substrate 110, and the entire structure of thewavelength-converting component 100 b is more stable. In addition,alternatively as shown in FIG. 8B, a width D3 of the reflective layer130 c is greater than a width D4 of the wavelength-converting layer 120c.

FIG. 9 is a schematic block diagram of a projection apparatus accordingto an embodiment of the invention. Please refer to FIG. 9. In theembodiment, the wavelength-converting component 100 is, for example, awavelength-converting wheel. The substrate 110 is, for example, aturntable. The projection apparatus 1 of the embodiment includes anillumination system 10, a light valve 20 and a projection lens 30. Theillumination system 10 is configured to provide an illumination beam L1.The illumination system 10 includes an excitation light source 11 andthe wavelength-converting component 100 (the wavelength-convertingwheel). The excitation light source 11 is configured to provide anexcitation beam Le. The wavelength-converting component 100 is disposedon a transmission path of the excitation beam Le, and includes thewavelength-converting layer 120 and the diffuse reflection layer 130.The wavelength-converting component 100 is configured to convert theexcitation beam Le into a converted beam Lp, and the illumination beamL1 includes the converted beam Lp, but is not limited thereto. Theillumination system 10 may further include other optical components, forexample, a light combining component, a filter wheel, a lighthomogenization component and a condenser lens, so that the illuminationbeam L1 is transmitted to the light valve 20. The light valve 20 isdisposed on the transmission path of the illumination beam L1 to convertthe illumination beam L1 into an image beam L2. The light valve 20 maybe a transmissive light valve or a reflective light valve, wherein thetransmissive light valve may be a liquid-crystal display (LCD) panel,and the reflective light valve may be a digital micro-mirror device(DMD) or a liquid crystal on silicon (LCoS) panel. According todifferent design structures, a quantity of the light valve may be one ora plurality. The projection lens 30 is disposed on a transmission pathof the image beam L2 and is configured to project the image beam L2 outof the projection apparatus 1.

FIG. 9 is an example of the wavelength-converting component 100 of FIG.1A, but the wavelength-converting component 100 can be replaced with thewavelength-converting component of any of the above embodiments.

Since the projection apparatus 1 of the embodiment uses thewavelength-converting components 100, 1001, 100 a, 100 b, 100 c with theabove-mentioned improved temperature resistance and less pores (asabove-mentioned, the pores affect the reflection effect and the heatconduction effect), the higher power excitation light source 11 can beused to reduce degradation in image brightness.

In summary, in the wavelength-converting component of the embodiments ofthe invention, the reflective layer includes the first organic adhesiveand the diffuse reflection particles. The first organic adhesiveincludes an aromatic polyimide. Since curing temperatures of the firstorganic adhesive using the above formula are only from 200° C. to 300°C., compared to a curing temperature of conventional glass-basedmaterial required to be greater than 400° C., the reflective layer ofthe embodiment of the invention can reduce the fine pores generated bysintering at a high temperature (>400° C.) and the characteristics ofeasily adsorbing liquids. The curing process where the temperature isincreased in stages, can improve mechanical properties such as shearstrength, tensile strength and fatigue strength of entire structure ofthe reflective layer. In addition, chemical stability of the benzenering structure contained in the aromatic polyimide is higher, which alsocontributes to the improvement of mechanical properties such as shearstrength, tensile strength and fatigue strength of entire structure ofthe reflective layer, and can improve temperature resistance. Thearomatic structure has a hydrophobic property, which can also reducerates of moisture absorption. If the wavelength-converting layer alsouses the first organic adhesive of the above formula, it also has theabove advantages. The manufacturing method of the wavelength-convertingcomponent of the embodiment of the invention uses the above-mentionedfirst organic adhesive, and therefore the above-mentionedwavelength-converting component can be produced. The projectionapparatus of the embodiments of the invention can reduce degradation inimage brightness by using the above-mentioned wavelength-convertingcomponent.

The foregoing description of the preferred embodiment of the inventionhas been presented for purposes of illustration and description. It isnot intended to be exhaustive or to limit the invention to the preciseform or to exemplary embodiments disclosed. Accordingly, the foregoingdescription should be regarded as illustrative rather than restrictive.Obviously, many modifications and variations will be apparent topractitioners skilled in this art. The embodiments are chosen anddescribed in order to best explain the principles of the invention andits best mode practical application, thereby to enable persons skilledin the art to understand the invention for various embodiments and withvarious modifications as are suited to the particular use orimplementation contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto and their equivalentsin which all terms are meant in their broadest reasonable sense unlessotherwise indicated. Therefore, the term “the invention” or the like isnot necessary limited the claim scope to a specific embodiment, and thereference to particularly preferred exemplary embodiments of theinvention does not imply a limitation on the invention, and no suchlimitation is to be inferred. The invention is limited only by thespirit and scope of the appended claims. Moreover, these claims mayrefer to use “first”, “second”, etc. following with noun or element.Such terms should be understood as a nomenclature and should not beconstrued as giving the limitation on the number of the elementsmodified by such nomenclature unless specific number has been given. Theabstract of the disclosure is provided to comply with the rulesrequiring an abstract, which will allow a searcher to quickly ascertainthe subject matter of the technical disclosure of any patent issued fromthis disclosure. It is submitted with the understanding that it will notbe used to interpret or limit the scope or meaning of the claims. Anyadvantages and benefits described may not apply to all embodiments ofthe invention. It should be appreciated that variations may be made inthe embodiments described by persons skilled in the art withoutdeparting from the scope of the invention as defined by the followingclaims. Moreover, no element and component in the disclosure is intendedto be dedicated to the public regardless of whether the element orcomponent is explicitly recited in the following claims. Furthermore,the terms such as the first surface, the second surface, the firstorganic adhesive and the second organic adhesive are only used fordistinguishing various elements and do not limit the number of theelements.

What is claimed is:
 1. A wavelength-converting component, comprising: asubstrate; a wavelength-converting layer, disposed on the substrate; anda reflective layer, disposed between the substrate and thewavelength-converting layer, the reflective layer comprises a pluralityof diffuse reflection particles and a first organic adhesive, thediffuse reflection particles are mixed in the first organic adhesive,and the first organic adhesive comprises an aromatic polyimide.
 2. Thewavelength-converting component according to claim 1, wherein curingtemperatures of the first organic adhesive are from 200° C. to 300° C.3. The wavelength-converting component according to claim 1, wherein thewavelength-converting layer comprises a wavelength-converting materialand a second organic adhesive, the wavelength-converting material ismixed in the second organic adhesive, and the second organic adhesivecomprises an aromatic polyimide.
 4. The wavelength-converting componentaccording to claim 3, wherein curing temperatures of the second organicadhesive are from 200° C. to 300° C.
 5. The wavelength-convertingcomponent according to claim 1, wherein the wavelength-convertingcomponent further comprises an intermediate layer disposed between thesubstrate and the reflective layer.
 6. The wavelength-convertingcomponent according to claim 5, wherein a thermal conductivity of thereflective layer is less than or equal to a thermal conductivity of theintermediate layer.
 7. The wavelength-converting component according toclaim 1, wherein the wavelength-converting layer comprises awavelength-converting material and an inorganic adhesive, thewavelength-converting material is mixed in the inorganic adhesive, andthe inorganic adhesive comprises at least one of a glass paste, a waterglass and a silica gel.
 8. The wavelength-converting component accordingto claim 1, wherein the wavelength-converting layer comprises a phosphorin glass, a phosphor in ceramic, a polycrystalline fluorescent sheet, amonocrystalline fluorescent sheet or a phosphor in silicon.
 9. Aprojection apparatus, comprising: an illumination system, configured toprovide an illumination beam, wherein the illumination system comprises:an excitation light source, configured to provide an excitation beam;and a wavelength-converting component, disposed on a transmission pathof the excitation beam, wherein the wavelength-converting component isconfigured to convert the excitation beam into a converted beam, theillumination beam comprises the converted beam, and thewavelength-converting component comprises: a substrate; awavelength-converting layer, disposed on the substrate; and a reflectivelayer, disposed between the substrate and the wavelength-convertinglayer, wherein the reflective layer comprises a plurality of diffusereflection particles and a first organic adhesive, the diffusereflection particles are mixed in the first organic adhesive, and thefirst organic adhesive comprises an aromatic polyimide; a light valve,disposed on a transmission path of the illumination beam to convert theillumination beam into an image beam; and a projection lens, disposed ona transmission path of the image beam.